PCB Capabilities
ZF's printed circuit board process capability
With over 15 years of experience as a professional printed circuit board (PCB) manufacturer, ZF Electronics offers a wide range of PCB process capabilities that can meet all of your PCB needs. Some of the key process capabilities that ZF can provide and support are detailed below, where you can find information on the specific materials we offer, the types of PCB technology or products currently in production, and some tolerances.
Available Printed Circuit Boards from ZF
The first category is "Quick-turn", which means that ZF can quickly provide small quantities of quick-turn PCBs with custom specifications.
The second category is "advanced" products. ZF can provide the best, full specification, highly specialized precision PCBs.
Key process capabilities offered and supported by ZF
1. Product Showcase
Rigid PCB, Flexible PCB, Rigid-flex PCB, Metal Core PCB, Aluminum PCB, Halogen-Free PCB, Thick Copper PCB, HDI PCB, Copper Based PCB
2.Surface treatment
| Surface treatment | Materials used |
| Electroless nickel gold plating (ENIG) | FR4 standard Tg |
| Hot Air Solder Level (HASL, Led, and Lead-Free) | FR4 Medium Tg |
| OSP, Dip Tin, Dip Silver, ENEPIG | FR4 High Tg |
| Gold Finger, Flash Gold, Full Body Hard Gold, Solderable Wire Gold | Halogen Free |
| Selective and multiple surface finishes | RF materials |
| Carbon ink, peelable SM | Flexible circuit materials, aluminum backplanes |
Type | Fast Prototype | Volume Production |
Scope | Double Side、Multilayers(4-20) | Multilayers(4-28), HDI(4-20)Flex, Rigid Flex |
Double PCB | CEM-3, FR-4, Rogers RO4233,Bergquist Thermal Clad 12mil–126mil (0.3mm-3.2mm) | CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm) |
Multilayers | 4-20 layers, board thickness 15mil-126mil （0.38mm-3.2mm） | 4-28 layers, board thickness 8mil-126mil （0.2mm-3.2mm） |
Buried/Blind Via | 4-18 layers, board thickness 15mil-126mil（0.38mm-3.2mm） | 4-20 layers, board thickness 10mil-126mil（0.25mm-3.2mm） |
HDI | / | 1+N+1, 2+N+2, 3+N+3, Anylayer |
Flex & Rigid-Flex PCB | / | 1-8layers Flex PCB, 2-12layers Rigid-flex PCB HDI+Rigid-flex PCB |
Laminate | Shengyi, EMC, ITEQ, Panasionic, Hitachi... |
Soldermask Type(LPI) | Taiyo, Goo's, Probimer... | Taiyo, Goo's, Probimer FPC... |
Peelable Soldermask | Peters |
Carbon ink | Nippon |
HASL/Lead-Free HASL | Thickness: 0.5-40um | Thickness: 0.5-40um |
OSP | Entek Plus HT, Preflux F2 LX |
ENIG (Ni-Au) | Au:0.03um≤max＜0.06um Ni:3um≤max≤6um |
Electro-bondable Ni-Au | Au:0.2-1.0um Ni: 2.54-10um |
Electro-nickel palladium Ni-Au |
| Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm |
Electro. Hard Gold | Au:5~50uin(0.125~1.27um); Nithickness:100~250uin(2.50~6.25um) |
Thick tin | 1.0-1.4um |
Capability | Mass Production | Mass Production |
Min Mechanical Drill Hole | 0.20mm | 0.20mm |
Min. Laser Drill Hole | / | 4mil (0.100mm) |
Line Width/Spacing | 3mil/3mil | 2mil/2mil |
Max. Panel Size | 18.5" X 24.5"(470mm X 622mm) | 21.5" X 24.5"(546mm X 622mm) |
Line Width/Spacing Tolerance | +/-10% ~ +/-20% | Non electro coating:+/-5um，Electro coating:+/-10um |
PTH Hole Tolerance | +/-0.003inch(0.075mm) | +/-0.002inch(0.050mm) |
NPTH Hole Tolerance | +/-0.002inch(0.050mm) | +/-0.002inch(0.050mm) |
Hole Location Tolerance | +/-0.003inch(0.075mm) | +/-0.002inch(0.050mm) |
Hole to Edge Tolerance | +/-0.004inch(0.100mm) | +/-0.004inch(0.100mm) |
Edge to Edge Tolerance | +/-0.004inch(0.100mm) | +/-0.004inch(0.100mm) |
Layer to Layer Tolerance | +/-0.004inch(0.100mm) | +/-0.003inch(0.075mm) |
Impedance Tolerance | +/- 10% | +/- 10% |
Warpage % | Max ≤0.75% | Max≤0.5% |
Technology (HDI Product) |
ITEM | Production | Tighten Control |
Laser Via Drill/Pad | 0.125/0.30, 0.125/0.38 | 0.125/0.28, 0.125/0.36, 0.20/0.40 |
Blind Via Drill/Pad | 0.25/0.50 | 0.20/0.45 |
Line Width/Spacing | 0.10/0.10 | 0.075/0.075 |
Hole Formation | CO2 Laser Direct Drill |
|
Build Up Material | FR4 LDP(LDD); RCC 50 ~100 micron |
|
Cu Thickness on Hole Wall | Blind Hole: 10um(min) | Buried Hole: 13um(min) |
Aspect Ratio | 0.8: 1 |
|
Technology (Flexible PCB) |
Project | Ability |
Roll to roll (one side) | YES |
Roll to roll (double) | NO |
Volume to roll material width mm | 250 |
Minimum production size mm | 250x250 |
Maximum production size mm | 500x500 |
SMT Assembly patch (Yes/No) | YES |
Air Gap capability (Yes/No) | YES |
Production of the hard and soft binding plate(Yes/No) | YES |
Max layers(Hard) | 10 |
Tallest layer(Soft plate) | 6 |
Material Science |
|
PI | YES |
PET | YES |
Electrolytic copper | YES |
Rolled Anneal Copper Foil | YES |
PI |
|
Covering film alignment tolerance mm | ±0.1 |
Minimum covering film mm | 0.175 |
Reinforcement |
|
PI | YES |
FR-4 | YES |
SUS | YES |
EMI SHIELDING |
|
Silver Ink | YES |
Silver Film | YES |
